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This paper presents an effective solution for the transient analysis of long bus-like interconnects with the inclusion of geometrical and material uncertainties of the structure. The proposed approach is based on the expansion of the well-known frequency-domain telegraph equations in terms of orthogonal polynomials and on the back conversion to time domain via Fourier superposition. The method is validated by means of a systematic comparison with the results of Monte Carlo simulations, for an application example involving a PCB coupled-microstrip interconnect with uncertainties in the relative dielectric permittivity and trace separatio